
UP Squared 6000
小型高性能工业计算创客板(101.6mm x 101.6mm),由Intel® Atom® x6000E/RE, Pentium®或Celeron® N/J系列SoC (原名为Elkhart Lake)动力驱动。
功能特点
- UP Squared 6000系列,搭载Intel Atom® x6000E系列, Intel® Pentium®及Intel® Celeron® N和J系列处理器(原名为Elkhart Lake)
- Intel® UHD显卡
- 1x 被动式散热片, 1x RTC电池
产品介绍
UP Squared 6000基于Intel® Atom® x6000E系列、Intel Pentium®及Celeron® N和J系列处理器(原名为Elkhart Lake),与上一代Intel处理器相比,提供了高达1.7倍的更快CPU速度和两倍的3D图形性能。
UP Squared 6000专为自动化、机器人和工业应用而设计,提供一系列工业功能,如时间敏感网络(TSN)、时间协调计算(TCC)*、带内ECC*、板载TPM 2.0*,以及一个用于解锁PSE应用的附加载板*。
UP Squared 6000将5G连接、灵活的I/O加载和强大的计算能力带入了一个令人印象深刻的节能平台。与以往相比,UP Squared 6000具有更大的可扩展性、灵活性和工业特性,将边缘计算提升到了一个新的水平。
技术规格
UP Squared 6000
General | |
SKU | UP Squared 6000 with Add-Ons |
Basic info | |
Part number | UP 6000 with Add-Ons |
Availability/Type | Active |
System level | |
SoC | Intel® Celeron® N6210 (up to 2.6Ghz) |
# of Core | 2 |
Graphics | Intel® UHD Graphics |
VPU | optional (via M.2 2280) |
memory | 2GB |
eMMC/Storage | 32GB |
BIOS | UEFI |
RTC | Yes |
WAKE ON LAN (WoL) | Yes |
Watchdog timer | Yes |
PXE | Yes |
Compatible OS | Windows 10/ 10 IoT Core, Linux: Ubuntu 20.04, Yocto 3.1 |
Pre-installed OS | NA |
Power requirement | 12V ( with +/- 5% tolerance) |
Power Supply Type | AT (default) /ATX |
Power Consumption ( typical) | 22 Watt |
Dimension | 4" x 4" (10.16cm x 10.16cm ) |
Operation temperature | 32°F ~ 140°F (0°C ~ 60°C) |
Storage temperature | -40°F ~ 176°F (-40°C ~ 80°C) |
Operation Humidity | 0% ~ 90% relative humidity, non-condensing |
MTBF ( hours) | T.B.A. |
Certification | CE/FCC Class A,RoHS |
Display | |
HDMI | 1x (HDMI 2.0b) |
Display Port | 1x DP 1.2 |
MIPI DSI/ eDP | N/A |
I/O | |
Audio | Mic-in/ Line out wafer |
USB 3.2 (Type A) | 2x USB 3.2 Gen2 Type A (STACK connector) |
UART | 1 x UART via Carrier Board |
Serial port | N/A |
HDD interface | 1x SATA with power connector |
Expansion Slot | 1x M.2 2280 M Key (supports NMVe SSD), 1x M.2 2230 E Key, 1x M.2 3052 B Key |
40-pin GP-Bus | 1 |
100-pin GP Bus | N/A |
MIPI-CSI | N/A |
SIM slot | No |
Others | TPM2.0 (SPI SLB9670VQ20FW785 ) on board 1x micro SIM slot on Carrier Board |
Connectivity | |
Ethernet | 1x 1 GbE RJ-45 (Intel I211-AT) 1x 1/2.5 GbE RJ-45 (Intel I225-V, support TSN) |
WiFi | optional ( via. M.2 2230 ) |
Bluetooth | optional ( via. M.2 2230 ) |
LTE/4G/5G | optional ( via. M.2 3052 ) |
Cooling | |
Cooling | passive cooling (fanless) |
Longevity | |
Longevity | 2035 |
Accessories | |
Accessories | 1x RTC battery, 1x passive heatsink |
Package | |
Net weight | 200g |
Package dimension (L x W x H) | 157*147*68mm |
Gross weight | 350g |
HS Code | 8473302000 |
Country of Origin | Taiwan |
产品内容与配件等资讯请下载「规格书」以参考详情。