
UP Squared 6000
A high-performance industrial computing maker board at small form factor (101.6mm x 101.6mm) powered by Intel® Atom® x6000E/RE, Pentium® or Celeron® N/J series SoC (formerly Elkhart Lake).
Features
- UP Squared 6000 Series with the Intel Atom® x6000E Series, Intel® Pentium®, and Intel® Celeron® N and J
- Series processors (formerly Elkhart Lake)
- Intel® UHD Graphics
- 1x Passive heatsink, 1x RTC battery
Based on the Intel® Atom® x6000E series and Intel Pentium® and Celeron® N and J series Processors (formerly Elkhart Lake), UP Squared 6000 offers up to 1.7x faster CPU speeds and twice the performance for 3D graphics compared to previous generation Intel processors.
Built for automation, robotics, and industrial applications, UP Squared 6000 offers a range of industrial features such as Time-Sensitive Networking (TSN), Time-Coordinated Computing (TCC)*, in-band ECC*, onboard TPM 2.0*, and an additional carrier board* to unlock PSE applications.
UP Squared 6000 brings 5G connectivity, a flexible I/O loadout, and powerful computing to an impressive power-efficient platform. With more expandability, flexibility, and industrial features than ever before, the UP Squared 6000 brings edge computing to the next level.
General | |
SKU | UP Squared 6000 with Add-Ons |
Basic info | |
Part number | UP 6000 with Add-Ons |
Availability/Type | Active |
System level | |
SoC | Intel® Celeron® N6210 (up to 2.6Ghz) |
# of Core | 2 |
Graphics | Intel® UHD Graphics |
VPU | optional (via M.2 2280) |
memory | 2GB |
eMMC/Storage | 32GB |
BIOS | UEFI |
RTC | Yes |
WAKE ON LAN (WoL) | Yes |
Watchdog timer | Yes |
PXE | Yes |
Compatible OS | Windows 10/ 10 IoT Core, Linux: Ubuntu 20.04, Yocto 3.1 |
Pre-installed OS | NA |
Power requirement | 12V ( with +/- 5% tolerance) |
Power Supply Type | AT (default) /ATX |
Power Consumption ( typical) | 22 Watt |
Dimension | 4" x 4" (10.16cm x 10.16cm ) |
Operation temperature | 32°F ~ 140°F (0°C ~ 60°C) |
Storage temperature | -40°F ~ 176°F (-40°C ~ 80°C) |
Operation Humidity | 0% ~ 90% relative humidity, non-condensing |
MTBF ( hours) | T.B.A. |
Certification | CE/FCC Class A,RoHS |
Display | |
HDMI | 1x (HDMI 2.0b) |
Display Port | 1x DP 1.2 |
MIPI DSI/ eDP | N/A |
I/O | |
Audio | Mic-in/ Line out wafer |
USB 3.2 (Type A) | 2x USB 3.2 Gen2 Type A (STACK connector) |
UART | 1 x UART via Carrier Board |
Serial port | N/A |
HDD interface | 1x SATA with power connector |
Expansion Slot | 1x M.2 2280 M Key (supports NMVe SSD), 1x M.2 2230 E Key, 1x M.2 3052 B Key |
40-pin GP-Bus | 1 |
100-pin GP Bus | N/A |
MIPI-CSI | N/A |
SIM slot | No |
Others | TPM2.0 (SPI SLB9670VQ20FW785 ) on board 1x micro SIM slot on Carrier Board |
Connectivity | |
Ethernet | 1x 1 GbE RJ-45 (Intel I211-AT) 1x 1/2.5 GbE RJ-45 (Intel I225-V, support TSN) |
WiFi | optional ( via. M.2 2230 ) |
Bluetooth | optional ( via. M.2 2230 ) |
LTE/4G/5G | optional ( via. M.2 3052 ) |
Cooling | |
Cooling | passive cooling (fanless) |
Longevity | |
Longevity | 2035 |
Accessories | |
Accessories | 1x RTC battery, 1x passive heatsink |
Package | |
Net weight | 200g |
Package dimension (L x W x H) | 157*147*68mm |
Gross weight | 350g |
HS Code | 8473302000 |
Country of Origin | Taiwan |