UP Squared 6000

UP Squared 6000

A high-performance industrial computing maker board at small form factor (101.6mm x 101.6mm) powered by Intel® Atom® x6000E/RE, Pentium® or Celeron® N/J series SoC (formerly Elkhart Lake).


功能特性

  • UP Squared 6000 Series with the Intel Atom® x6000E Series, Intel® Pentium®, and Intel® Celeron® N and J
  • Series processors (formerly Elkhart Lake)
  • Intel® UHD Graphics
  • 1x Passive heatsink, 1x RTC battery
產品介紹

Based on the Intel® Atom® x6000E series and Intel Pentium® and Celeron® N and J series Processors (formerly Elkhart Lake), UP Squared 6000 offers up to 1.7x faster CPU speeds and twice the performance for 3D graphics compared to previous generation Intel processors.

Built for automation, robotics, and industrial applications, UP Squared 6000 offers a range of industrial features such as Time-Sensitive Networking (TSN), Time-Coordinated Computing (TCC)*, in-band ECC*, onboard TPM 2.0*, and an additional carrier board* to unlock PSE applications.

UP Squared 6000 brings 5G connectivity, a flexible I/O loadout, and powerful computing to an impressive power-efficient platform. With more expandability, flexibility, and industrial features than ever before, the UP Squared 6000 brings edge computing to the next level.

產品規格
UP Squared 6000

General

SKU UP Squared 6000 with Add-Ons

Basic info

Part number UP 6000 with Add-Ons
Availability/Type Active

System level

SoC Intel® Celeron® N6210 (up to 2.6Ghz)
# of Core 2
Graphics Intel® UHD Graphics
VPU optional (via M.2 2280)
memory 2GB
eMMC/Storage 32GB
BIOS UEFI
RTC Yes
WAKE ON LAN (WoL) Yes
Watchdog timer Yes
PXE Yes
Compatible OS Windows 10/ 10 IoT Core, Linux: Ubuntu 20.04, Yocto 3.1
Pre-installed OS NA
Power requirement 12V ( with +/- 5% tolerance)
Power Supply Type AT (default) /ATX
Power Consumption ( typical) 22 Watt
Dimension 4" x 4" (10.16cm x 10.16cm )
Operation temperature 32°F ~ 140°F (0°C ~ 60°C)
Storage temperature -40°F ~ 176°F (-40°C ~ 80°C)
Operation Humidity 0% ~ 90% relative humidity, non-condensing
MTBF ( hours) T.B.A.
Certification CE/FCC Class A,RoHS

Display

HDMI 1x (HDMI 2.0b)
Display Port 1x DP 1.2
MIPI DSI/ eDP N/A

I/O

Audio Mic-in/ Line out wafer
USB 3.2 (Type A) 2x USB 3.2 Gen2 Type A (STACK connector)
UART 1 x UART via Carrier Board
Serial port N/A
HDD interface 1x SATA with power connector
Expansion Slot 1x M.2 2280 M Key (supports NMVe SSD), 1x M.2 2230 E Key, 1x M.2 3052 B Key
40-pin GP-Bus 1
100-pin GP Bus N/A
MIPI-CSI N/A
SIM slot No
Others TPM2.0 (SPI SLB9670VQ20FW785 ) on board 1x micro SIM slot on Carrier Board

Connectivity

Ethernet 1x 1 GbE RJ-45 (Intel I211-AT) 1x 1/2.5 GbE RJ-45 (Intel I225-V, support TSN)
WiFi optional ( via. M.2 2230 )
Bluetooth optional ( via. M.2 2230 )
LTE/4G/5G optional ( via. M.2 3052 )

Cooling

Cooling passive cooling (fanless)

Longevity

Longevity 2035

Accessories

Accessories 1x RTC battery, 1x passive heatsink

Package

Net weight 200g
Package dimension (L x W x H) 157*147*68mm
Gross weight 350g
HS Code 8473302000
Country of Origin Taiwan
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