UP Squared 6000

UP Squared 6000

A high-performance industrial computing maker board at small form factor (101.6mm x 101.6mm) powered by Intel® Atom® x6000E/RE, Pentium® or Celeron® N/J series SoC (formerly Elkhart Lake).


功能特性

  • UP Squared 6000 Series with the Intel Atom® x6000E Series, Intel® Pentium®, and Intel® Celeron® N and J
  • Series processors (formerly Elkhart Lake)
  • Intel® UHD Graphics
  • 1x Passive heatsink, 1x RTC battery
產品介紹

基於Intel® Atom® x6000E系列、以及Intel Pentium®和Celeron® N和J系列處理器(前身為Elkhart Lake),UP Squared 6000提供高達前一代Intel處理器的1.7倍快速的CPU速度,以及3D圖形性能的兩倍提升。

針對自動化、機器人和工業應用而建,UP Squared 6000提供一系列工業特性,如時間敏感網絡(TSN)、時間協調計算(TCC)*、帶內ECC*、機板上的TPM 2.0*,以及額外的擴展板*,以支援PSE應用。

UP Squared 6000結合了5G連接性、靈活的I/O配置和強大的計算能力,成為一個出色的高效能平台。比以往任何時候都擁有更多的擴展性、靈活性和工業特性,UP Squared 6000將邊緣運算推向了新的高度。

產品規格
UP Squared 6000

General

SKU UP Squared 6000 with Add-Ons

Basic info

Part number UP 6000 with Add-Ons
Availability/Type Active

System level

SoC Intel® Celeron® N6210 (up to 2.6Ghz)
# of Core 2
Graphics Intel® UHD Graphics
VPU optional (via M.2 2280)
memory 2GB
eMMC/Storage 32GB
BIOS UEFI
RTC Yes
WAKE ON LAN (WoL) Yes
Watchdog timer Yes
PXE Yes
Compatible OS Windows 10/ 10 IoT Core, Linux: Ubuntu 20.04, Yocto 3.1
Pre-installed OS NA
Power requirement 12V ( with +/- 5% tolerance)
Power Supply Type AT (default) /ATX
Power Consumption ( typical) 22 Watt
Dimension 4" x 4" (10.16cm x 10.16cm )
Operation temperature 32°F ~ 140°F (0°C ~ 60°C)
Storage temperature -40°F ~ 176°F (-40°C ~ 80°C)
Operation Humidity 0% ~ 90% relative humidity, non-condensing
MTBF ( hours) T.B.A.
Certification CE/FCC Class A,RoHS

Display

HDMI 1x (HDMI 2.0b)
Display Port 1x DP 1.2
MIPI DSI/ eDP N/A

I/O

Audio Mic-in/ Line out wafer
USB 3.2 (Type A) 2x USB 3.2 Gen2 Type A (STACK connector)
UART 1 x UART via Carrier Board
Serial port N/A
HDD interface 1x SATA with power connector
Expansion Slot 1x M.2 2280 M Key (supports NMVe SSD), 1x M.2 2230 E Key, 1x M.2 3052 B Key
40-pin GP-Bus 1
100-pin GP Bus N/A
MIPI-CSI N/A
SIM slot No
Others TPM2.0 (SPI SLB9670VQ20FW785 ) on board 1x micro SIM slot on Carrier Board

Connectivity

Ethernet 1x 1 GbE RJ-45 (Intel I211-AT) 1x 1/2.5 GbE RJ-45 (Intel I225-V, support TSN)
WiFi optional ( via. M.2 2230 )
Bluetooth optional ( via. M.2 2230 )
LTE/4G/5G optional ( via. M.2 3052 )

Cooling

Cooling passive cooling (fanless)

Longevity

Longevity 2035

Accessories

Accessories 1x RTC battery, 1x passive heatsink

Package

Net weight 200g
Package dimension (L x W x H) 157*147*68mm
Gross weight 350g
HS Code 8473302000
Country of Origin Taiwan
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