UP Squared Pro
Powered by Intel® processors formerly Apollo Lake, the UP Squared Pro brings a range of features to leverage new technologies and accelerate Edge deployment.
Features
- UP Squared Pro with the powerful Intel® Apollo Lake, up to 2.5GHz (Celeron® N3350 / Pentium® N4200 / Atom® x7-E3950)
- Intel® HD Graphics
- 1x Passive Heatsink, 1x RTC Battery
Based on the powerful Intel platform, formerly Apollo Lake, UP Squared Pro is the latest addition to our wide range of UP products. It is built for industrial use and capable of enabling next generation industrial automation and AI solutions, with extension capabilities to existing modules or our next generation of AI Modules.
Unleash the future of industrial automation and AI vision with 5G connectivity and take your solutions to the PRO level.
The expansion boards are available in M.2 2230, M.2 2280 and M.2 3052 that provides options for project specific requirements, for the ultimate Edge solution. The board’s industrial setup with multiple serial ports, ethernet ports(with TSN), 5G support, audio ports, and a range of other features make it a perfect solution for different domains and products like Automation, Robotics, Drones, Machine Vision, and Internet Of Things.
UP board version | UP Squared Pro |
| SoC | Intel® Celeron® Duo Core N3350 (up to 2.4 GHz) Intel® Pentium®Quad Core N4200 (up to 2.5 GHz) Intel Atom® Quad Core x7-E3950 Processor (up to 2.0 GHz) |
| Processor TDP | 6W – 12W depends on CPU |
| VPU | Optional via M.2 2280 |
| Graphics | Intel® HD Graphics 500 for Intel® Celeron® N3350 Intel® HD Graphics 505 for Intel® Pentium® N4200 / Intel Atom® x7-E3950 |
| FPGA | Intel® FPGA Altera MAX 10 |
| System memory | 2GB, 4GB, 8GB |
| Storage capacity | 32GB, 64GB |
| BIOS | UEFI |
| Compatible operating system | Microsoft Windows 10 full version, Linux ( Ubuntu, Yocto) |
| Power | 12V~24V DC-IN (lockable connector) 1x Power Button / LED |
| Power supply type | AT/ATX |
| Power consumption (typical) | 20W |
| Operating temperature | 0°C-60°C (32°F ~ 140°F) |
| Storage Temperature | -40°C ~ 80°C (-40°F ~ 176°F) |
| Operating humidity | 0% ~ 90% relative humidity, non-condensing |
| Certification | CE/FCC Class A |
| RTC | YES |
| HS code | 8473302000 |
| Cooling | Fanless |
| Country of Origin | Taiwan |
| Longevity | 2031 |
Display | |
| HDMI | 1 (HDMI 1.4b) |
| DP | 1x DP 1.2 (4K@60hz) |
| MIPI DSI/ eDP | 1 x eDP |
I/O | |
| Audio | 1x Mic in, 1x Line out |
| USB | 3x USB 3.0 Type A 1x USB 3.0 OTG |
| UART | 2 x UART (Tx/Rx) debug port (pin header) |
| Serial port | 2x RS232/422/485 |
| HDD interface | 1x SATA 3.0 |
| Expansion Slot | 1x M.2 E key 2230 1x M.2 M key 2280 1x M.2 B key co-lay 3042/3052 |
| SIM slot | 1 |
| Others | Infineon TPM SLB9670 on board |
Connectivity | |
| Ethernet | 2x GbLAN (Intel i210 AT) support TSN |
| WiFi | Optional (via M.2 2230) — Intel® AC9260 card |
| Bluetooth | Optional (via M.2 2230) — Intel® AC9260 card |
| LTE/4G/ 5G | Optional (via M.2 3042/3052 B co-lay) |
Package | |
| Net weight | 219 gm |
| Gross weight | TBC |
| Product dimension | 101.6 x 101.6mm (4″ x 4″) |