UP Xtreme i11

UP Xtreme i11

由第11代Intel® Core™处理器动力驱动,具有Iris® Xe graphics (原名为Tiger Lake UP3)。它为边缘人工智能(AI)提供了更高的性能和效率。


功能特点

  • 强劲: 最新的第11代Intel® Core™处理器,具有Iris® Xe graphics
  • 快速: NVMe, USB 3.2
  • 可扩展: M.2 2230 E key, M.2 2280 M key, M.2 3052 B Key, PCIe [x4]允许无缝集成
  • 连接就绪: 5G, WiFi ( WiFi 5/WiFi 6), 蓝牙连接就绪
产品介绍

UP Xtreme i11有一个M.2 3052插槽,支持5G模块,以实现大量物联网设备之间的超低延迟和可靠数据传输,从而确保5G、人工智能、云计算、数据分析和IIOT的融合。

结合英特尔人工智能加速器和Intel®发行版OpenVINO™工具包,加速了计算机视觉(CV)和从边缘到云的深度学习推理。它还提供预训练模型和预优化内核,以提高人工智能的性能。

技术规格
VPC-3350AI

System

Form Factor Multi-PoE & Fanless Appliance
Processor Intel® Pentium®/ Celeron®/ Atom™ Processor (Default: E3940; Project base: N4200/N3350, or E3950 w/ customized chassis)
AI Accelerator 2 x Intel® Myriad™ X, up to 4 Myriad™ X (Project base)
Main Memory Up to 8GB, DDR3L 204-pin SODIMM
Display HDMI x 1, DP x 1
Ethernet Intel® i211 (colay i210)
Smart PoE 4 ports, sharing 60W of power budget for every four PoE ports
RAID support
Expansion Slot SATA x 1
GPS, G-Sensor
Front I/O Panel Power Button x 1, Reset Button x 1 Power/HDD, LED x 2 USB 3.2 Gen 1 x 2, GbE port (RJ-45) x 1, PoE LAN x 4 (IEEE 802.3 at/af) HDMI x 1
Rear I/O Panel DC-In power x 1, 8-bit DIO x 1, 4-ch digital input, 4-ch digital output RS-232/422/485 x 2, DP x 1, Audio Line-out x 1, Mic-In x 1 Micro SIM slot x 2

Storage

HDD Tray 2.5” HDD/SSD Bay x 1
CF/CFast/mSATA Slot

Environmental

Operating Temperature -4°F ~ 140°F (-20°C ~ 60°C)
Storage Temperature -40°F ~ 185°F (-40°C ~ 85°C)
Storage Humidity 10%~80% @40°C, non-condensing
Vibration/Shock MIL-STD-810G
Certification CE & FCC Class A

Power Requirement

Power Supply DC 12-24V

Mechanical

Removable HDD Tray
Internal System HDD Bay
Dimension 6.3” x 5.28” x 2.44” (160mm x 134mm x 62mm)
Gross Weight 5.07 lb (2.3 kg)
Note
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