
UP Squared Pro
Powered by Intel® processors formerly Apollo Lake, the UP Squared Pro brings a range of features to leverage new technologies and accelerate Edge deployment.
功能特性
- UP Squared Pro with the powerful Intel® Apollo Lake, up to 2.5GHz (Celeron® N3350 / Pentium® N4200 / Atom® x7-E3950)
- Intel® HD Graphics
- 1x Passive Heatsink, 1x RTC Battery
基於強大的Intel平台,前身為Apollo Lake,UP Squared Pro是我們廣泛產品系列中的最新成員。它專為工業使用而建,能夠啟用下一代工業自動化和AI解決方案,並具有擴展現有模組或我們下一代AI模組的能力。
利用5G連接性釋放工業自動化和AI視覺的未來,並將您的解決方案提升至專業級別。
擴展板提供M.2 2230、M.2 2280和M.2 3052等多種選擇,滿足專案特定需求,打造終極邊緣解決方案。該板具有工業設置,擁有多個串行端口、帶有TSN的乙太網口、5G支持、音訊端口以及一系列其他功能,非常適合自動化、機器人、無人機、機器視覺和物聯網等不同領域和產品的應用。
UP board version | UP Squared Pro |
SoC | Intel® Celeron® Duo Core N3350 (up to 2.4 GHz) Intel® Pentium®Quad Core N4200 (up to 2.5 GHz) Intel Atom® Quad Core x7-E3950 Processor (up to 2.0 GHz) |
Processor TDP | 6W – 12W depends on CPU |
VPU | Optional via M.2 2280 |
Graphics | Intel® HD Graphics 500 for Intel® Celeron® N3350 Intel® HD Graphics 505 for Intel® Pentium® N4200 / Intel Atom® x7-E3950 |
FPGA | Intel® FPGA Altera MAX 10 |
System memory | 2GB, 4GB, 8GB |
Storage capacity | 32GB, 64GB |
BIOS | UEFI |
Compatible operating system | Microsoft Windows 10 full version, Linux ( Ubuntu, Yocto) |
Power | 12V~24V DC-IN (lockable connector) 1x Power Button / LED |
Power supply type | AT/ATX |
Power consumption (typical) | 20W |
Operating temperature | 0°C-60°C (32°F ~ 140°F) |
Storage Temperature | -40°C ~ 80°C (-40°F ~ 176°F) |
Operating humidity | 0% ~ 90% relative humidity, non-condensing |
Certification | CE/FCC Class A |
RTC | YES |
HS code | 8473302000 |
Cooling | Fanless |
Country of Origin | Taiwan |
Longevity | 2031 |
Display | |
HDMI | 1 (HDMI 1.4b) |
DP | 1x DP 1.2 (4K@60hz) |
MIPI DSI/ eDP | 1 x eDP |
I/O | |
Audio | 1x Mic in, 1x Line out |
USB | 3x USB 3.0 Type A 1x USB 3.0 OTG |
UART | 2 x UART (Tx/Rx) debug port (pin header) |
Serial port | 2x RS232/422/485 |
HDD interface | 1x SATA 3.0 |
Expansion Slot | 1x M.2 E key 2230 1x M.2 M key 2280 1x M.2 B key co-lay 3042/3052 |
SIM slot | 1 |
Others | Infineon TPM SLB9670 on board |
Connectivity | |
Ethernet | 2x GbLAN (Intel i210 AT) support TSN |
WiFi | Optional (via M.2 2230) — Intel® AC9260 card |
Bluetooth | Optional (via M.2 2230) — Intel® AC9260 card |
LTE/4G/ 5G | Optional (via M.2 3042/3052 B co-lay) |
Package | |
Net weight | 219 gm |
Gross weight | TBC |
Product dimension | 101.6 x 101.6mm (4″ x 4″) |