UP Squared Pro

UP Squared Pro

Powered by Intel® processors formerly Apollo Lake, the UP Squared Pro brings a range of features to leverage new technologies and accelerate Edge deployment.


  • UP Squared Pro with the powerful Intel® Apollo Lake, up to 2.5GHz (Celeron® N3350 / Pentium® N4200 / Atom® x7-E3950)
  • Intel® HD Graphics
  • 1x Passive Heatsink, 1x RTC Battery

Based on the powerful Intel platform, formerly Apollo Lake, UP Squared Pro is the latest addition to our wide range of UP products. It is built for industrial use and capable of enabling next generation industrial automation and AI solutions, with extension capabilities to existing modules or our next generation of AI Modules.

Unleash the future of industrial automation and AI vision with 5G connectivity and take your solutions to the PRO level.

The expansion boards are available in M.2 2230, M.2 2280 and M.2 3052 that provides options for project specific requirements, for the ultimate Edge solution. The board’s industrial setup with multiple serial ports, ethernet ports(with TSN), 5G support, audio ports, and a range of other features make it a perfect solution for different domains and products like Automation, Robotics, Drones, Machine Vision, and Internet Of Things.

UP Squared Pro

UP board version

UP Squared Pro


Intel® Celeron® Duo Core N3350 (up to 2.4 GHz)

Intel® Pentium®Quad Core N4200 (up to 2.5 GHz)

Intel Atom® Quad Core x7-E3950 Processor (up to 2.0 GHz)

Processor TDP 6W – 12W depends on CPU
VPU Optional via M.2 2280

Intel® HD Graphics 500 for Intel® Celeron® N3350

Intel® HD Graphics 505 for Intel® Pentium® N4200 / Intel Atom® x7-E3950

FPGA Intel® FPGA Altera MAX 10
System memory 2GB, 4GB, 8GB
Storage capacity 32GB, 64GB
Compatible operating system Microsoft Windows 10 full version, Linux ( Ubuntu, Yocto)

12V~24V DC-IN (lockable connector)

1x Power Button / LED

Power supply type AT/ATX
Power consumption (typical) 20W
Operating temperature 0°C-60°C (32°F ~ 140°F)
Storage Temperature -40°C ~ 80°C (-40°F ~ 176°F)
Operating humidity 0% ~ 90% relative humidity, non-condensing
Certification CE/FCC Class A
HS code 8473302000
Cooling Fanless
Country of Origin Taiwan
Longevity 2031


HDMI 1 (HDMI 1.4b)
DP 1x DP 1.2 (4K@60hz)


Audio 1x Mic in, 1x Line out

3x USB 3.0 Type A

1x USB 3.0 OTG

UART 2 x UART (Tx/Rx) debug port (pin header)
Serial port 2x RS232/422/485
HDD interface 1x SATA 3.0
Expansion Slot

1x M.2 E key 2230

1x M.2 M key 2280

1x M.2 B key co-lay 3042/3052

SIM slot 1
Others Infineon TPM SLB9670 on board


Ethernet 2x GbLAN (Intel i210 AT) support TSN
WiFi Optional (via M.2 2230) — Intel® AC9260 card
Bluetooth Optional (via M.2 2230) — Intel® AC9260 card
LTE/4G/ 5G Optional (via M.2 3042/3052 B co-lay)


Net weight 219 gm
Gross weight TBC
Product dimension 101.6 x 101.6mm (4″ x 4″)
For packing list, detailed specifications and other product information, download the Datasheet or User Manual.