UP Xtreme i12
UP Xtreme i12 Developer Board with 12th/13th Generation Intel® Core™ i7/i5/i3/Celeron® Processor SoC
Features
- 12th/13th Gen Intel® Core™ i7/i5/i3/Celeron® Processor SoC
- Onboard Dual Channel LPDDR5, up to 32GB
- 4 Independent Displays up to 4K at 60Ghz
- M.2 2280 M-Key x 2 (PCIe Gen 4 [x4])
- M.2 3052 B-Key (5G)
- Intel® Wi-Fi 6E AX210 Support
- TPM 2.0
- 40-pin HAT Connector
- USB 4.0 (Type-C)
- LAN x 2 (2.5GbE x 1, GbE x 1)
- Support for MIPI CSI/HDMI-in via 61-pin wafer (optional for 13th Gen SKUs)
An innovative next generation board, the UP Xtreme i12 hosts the 12 core, 16 thread hybrid architecture of 12th/13th Gen Intel® Core™ Processors (formerly Alder Lake-P/Raptor Lake-P). This configuration increases energy-efficiency while doubling its predecessor’s thread count.
Further, the UP Xtreme i12’s wide 12~36V power input range facilitates extended use for industrial applications, such as smart manufacturing. Customers can therefore harness CPU performance up to 20% greater than Tiger Lake while retaining continuous, efficient operation in more challenging environments.
Greater processing is enhanced by up to 32GB of onboard LPDDR5 system memory, doubling bandwidth and memory capacity without the need for SODIMM module installation. Combining this accelerated data processing with USB 4.0 and 2.5GbE ports ensures high-speed connectivity to peripheral cameras and sensors, making the UP Xtreme i12 the perfect board for smart retail. Additionally, the 2.47 x increase in graphics speed provided by Intel® Iris® Xe graphics, with four simultaneous 4K displays.
The UP Xtreme i12 offers unprecedented expandability. Supporting Wi-Fi 6 and 5G via M.2 2230 E and 3052 B-Keys, the UP Xtreme i12 also contains two M.2 2280 M-Keys for PCIe 4.0 storage and AI module support. Its AI performance is augmented by Intel® DL Boost and the Intel® distribution of OpenVINO™ toolkit, which yields up to 2.81 x the GPU image classification inferencing performance of the previous generation. Further, its Intel® i226IT ethernet package supports Time Sensitive Networking (TSN) to prioritize real-time workloads and execute tasks within precise time cycles. With such high-level performance, the UP Xtreme i12 presents an elite solution for IoT and robotics projects.
System | |
| Processor | 12th Gen Intel® Core™ Processor SoC |
| Graphics | Intel® Iris® Xe graphics |
| Memory | Up to 32GB onboard LPDDR5 |
| Storage | M.2 2280 M-Key x 2 (PCIe Gen 4.0 [x4]), SATA 6Gb/s x 1 |
| I/O | HDMI 2.0b x 1 |
| Camera | MIPI CSI camera via 61pin wafer w/carrier board (optional for 13th Gen) |
| USB | USB 2.0 x 2 (from 10 pin header x 1) |
| Expansion | 40-pin GPIO x 1 |
| Display Interface | HDMI 2.0b x 1, DP 1.4a x 1, DP 1.4a x 1 (via USB Type-C), eDP 1.4b x 1 |
| Ethernet | Intel® I226-IT x 1 (TSN), Intel® I219 x 1 (vPRO) |
| Security | Onboard TPM 2.0 |
| RTC | Yes |
| OS Support | Windows* 10 Enterprise 2021 LTSC, Ubuntu 22.04, Yocto 4.0 |
Power Requirement | |
| Power | 12-36V DC-in (Lockable plug) |
| Power Supply Type | AT/ATX (ATX as default) |
| Power Consumption (Typical) | Intel® Core™ i7-1270PE, LPDDR5 4800MHz 16GB, 5.86A@+ 12V (Typical) |
Mechanical | |
| Dimension | 4.74“ x 4.82“ (120.35mm x 122.5mm) |
| Net Weight | 0.88lb (0.4kg) |
| Gross Weight | 1.32lb (0.6kg) |
Environment | |
| Operating Temperature | With Heatsink: 32°F ~ 140°F (0°C ~ 60°C) / 0.5 airflow |
| Operation Humidity | 0% ~ 90% relative humidity, non-condensing |
| MTBF | 362,068 Hours |
| Certification | CE/FCC Class A, RoHS Compliant, REACH |